EE Solutions Inc. announces successfully joint development with Fabless IC Design customer on AI/ML real time learning and cognition ASIC to reach mass production on versatile scalable AI applications July 15, 2023
EE Solutions Inc. announces successfully joint development with Fabless IC Design customer on AI/ML real time learning and cognition ASIC to reach mass production on versatile scalable AI applications July 15, 2023
HSINCHU, TAIWAN – July 15, 2023 – EE Solutions Inc , a leading IC design and production service company today announced the joint development of AI/ML ASIC with Taiwan based Fabless IC design customer has passed all the function and performance test and successfully launched mass production stage, the IC development and fabricated in TSMC on 55nm technology. The embedded novel algorithm and architecture take the advantage of shrinkable logic gates and memory(SRAM, MRAM) to integrate different memory type and computation power into different advanced technologies (eg. 14nm for MRAM, 16nm for automotive in TSMC) for different purpose of real time learning and cognition suitable for different AI applications.
The AI ASIC joint development for customer since end of 2021, start from RTL through FPGA, ASIC Design porting and Validation, Physical Design, MPW and sample verification, Full Masks and customer samples manufacturing and verification, package and testing development , the neural network and software tools development. In Q1, 2023, customer has successfully launched the AI/ML ASIC products series to different segment and applications applied for AI with Real time learning and cognition based on required numbers of neurons, this AI ASIC product series featured up to max. 5500 parallel neurons can also perform 5500 vectors under smallest distance.
This new AI/ML ASIC implemented a novel architecture by consuming much less power under same ML and cognition performance; it is the key solution to resolve the major problems of current explosive growth of AI/ML computation and different applications. With the critical need for high performance-efficient deep learning, this AI/ML ASIC can operate at the network of edge and end-point, where power and energy constraints make it difficult to only rely on CPU/GPU/NPU architecture for different scale of applications. However based on the new AI/ML ASIC verification and performance test result, it can reach the performance to find k-NN of 1 vector versus 5500 vectors in 12 micro second (us) for only consume 160 Mw. That’s because it can parallel expanding the numbers of neurons by cascading numbers of ASIC on system to expand computing performance. From Fabless IC design customer’s experiment, with one millions RBF/k-NN neurons to become soon 5.5 millions by cascading ASICs on system also take only 12 us time. In the meanwhile, EE Solutions also supports other new AI/ML
Architecture’s ASIC under development, which is targeting at higher-end video
computing with Real time ML and Cognition.
As taking an significant growth of low latency applications on Al, and the high cost of data transfer to cloud, as well as he user data privacy through the cloud channels into account, the demands of Al computing power will gradually move from cloud to devices . Al ASIC is designed based on the specific algorithm and architecture so that both power consumption and computing power capability are better than CPU, FPGA and GPU. Based on the above characteristics, Al ASIC is implemented as closely as possible to data collection devices, which are so called "edge computing" and an increase in demand of Al ASIC applications is foreseeable.
With the popularity of generated content technology and computing power capability on Al, it would be predictable that Al ASIC would have the advantages on the application market and technology side for edge devices.
EE Solutions Inc provide different service for Fabless IC companies, System houses, Distributors to realize their new IC products from marketing, development, production by own and new IP development, ASIC development, Physical Design, Turnkey solution, IC Manufacturing on wafer, packaging, testing for an one-stop service for IC design and system customers in different market and applications.
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